With the help of a one-year, $100,000 grant from Cisco Systems Inc. we are developing a novel way to reduce heat in CPUs. Our goal is to develop new thermal materials and structures, including a micro-heat exchangers, that would help to manage the heat load without compromising performance or further increasing power consumption. Our project proposal includes a two-phase liquid cooling technology that can mitigate some of the heat coming from the stacked 3-D chips.

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