Current Research
Featured Publications
Kong, D., Jung, E., Kim, Y., Manepalli, V. V., Rah, K. J., Kim, H. S., Hong, Y., Choi, H. G., Agonafer, D., and Lee, H., 2023, “An Additively Manufactured Manifold-Microchannel Heat Sink for High-Heat Flux Cooling,” International Journal of Mechanical Sciences, 248, p. 108228.
Kong, D., Kim, K., Kang, M., Hong, Y., Kim, H.S., Rah, K., Choi, G., Guye, G., Agonafer, D., Lee, H., “Thermal hydraulic design of 3D manifold microchannel heat sinks for energy-efficient thermal management systems”, Case Studies in Thermal Engineering, 2021, DOI: https://doi.org/10.1016/j.csite.2021.101583.
Guye, K., Dong, D., Kim, Y., Lee, H., Dogruoz, B., Agonafer, D., “Guidelines for designing micropillar structures for enhanced evaporative heat transfer”, Journal of Electronic Packaging, 2021, DOI: https://doi.org/10.1115/1.4052465.
Agonafer, D., Miljkovic, N., Spector M.A., “Materials and Interface Challenges and Opportunities in High Vapor Quality Two-Phase Flow Boiling Research.”, IEEE Components & Transactions, 2021, DOI: https://doi.org/10.1109/TCPMT.2021.3085255.
Featured News
Kidus Guye won second place in a poster presentation at NASA’s 34th Thermal & Fluids Analysis Workshop.
Kidus Guye presented his work titled ‘Development of a Novel Direct-to-Chip Evaporator using Hollow Micropillars for Thermal Management in High
Emils Joins NEIT Lab in Fall 2023
Emils Jurcik joins NEIT lab this fall 2023 as a PhD student. He is co-advised by Prof. Samuel Graham and
NEIT Lab welcomes four new students in Fall 2023
Three new students join NEIT Lab starting this fall 2023. Emils Jurcik is a Ph.D. student (co-advised by Prof. Samuel