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Nanoscale Energy and Interfacial Transport
Nanoscale Energy and Interfacial Transport (NEIT) lab investigates heat transfer at nano, micro-, and mini-scale to develop novel microfluidic two-phase cold plates, phase change materials (PCM), packaging for novel wide band gap power electronics with applications in data centers, power electronics and high frequency communication systems. We work with both industry and government research organizations to investigate fundamental transport phenomena with the goal of development of disruptive thermal technologies.
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Nanoscale Energy and Interfacial Transport
Nanoscale Energy and Interfacial Transport (NEIT) lab investigates heat transfer at nano, micro-, and mini-scale to develop novel microfluidic two-phase cold plates, phase change materials (PCM), packaging for novel wide band gap power electronics with applications in data centers, power electronics and high frequency communication systems. We work with both industry and government research organizations to investigate fundamental transport phenomena with the goal of development of disruptive thermal technologies.
Nanoscale Energy and Interfacial Transport
Nanoscale Energy and Interfacial Transport (NEIT) lab investigates heat transfer at nano, micro-, and mini-scale to develop novel microfluidic two-phase cold plates, phase change materials (PCM), packaging for novel wide band gap power electronics with applications in data centers, power electronics and high frequency communication systems. We work with both industry and government research organizations to investigate fundamental transport phenomena with the goal of development of disruptive thermal technologies.
Click Here
Nanoscale Energy and Interfacial Transport
Nanoscale Energy and Interfacial Transport (NEIT) lab investigates heat transfer at nano, micro-, and mini-scale to develop novel microfluidic two-phase cold plates, phase change materials (PCM), packaging for novel wide band gap power electronics with applications in data centers, power electronics and high frequency communication systems. We work with both industry and government research organizations to investigate fundamental transport phenomena with the goal of development of disruptive thermal technologies.
Click Here
Nanoscale Energy and Interfacial Transport
Nanoscale Energy and Interfacial Transport (NEIT) lab investigates heat transfer at nano, micro-, and mini-scale to develop novel microfluidic two-phase cold plates, phase change materials (PCM), packaging for novel wide band gap power electronics with applications in data centers, power electronics and high frequency communication systems. We work with both industry and government research organizations to investigate fundamental transport phenomena with the goal of development of disruptive thermal technologies.
Click Here

Featured News

Mariah Joins NEIT Lab

August 20, 2023 No Comments

Andoniaina Mariah Randriambololona joins NEIT lab as PhD student. She graduated from University of the District of Columbia in 2022

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Current Research


NSF - Fundamental Transport Mechanisms of Evaporation From Non-Axisymmetric Droplets Confined on Hollow Micropillars Structures


ARPAe - Holistic Co-Design of Novel Hybrid Cooling Technology for the Data Center of the Future



AFOSR - Thermal Analysis and Packaging for Field Emitter Robust Vacuum Integrated Nanoelectronics


ARPAe - Multi-Objective Optimization Software for COOLERCHIPS



FROSTBITE - Reduction of Semiconductor Temperature using Backside and Topside diamond



PINN modeling for GaN hotspot prediction


DARPA - Thermal Analysis and Design of High Power GaN RF Devices


Composite phase change materials for ultra fast thermal regulation


Helix


Harnessing High Thermal Capacitance of Micro-encapsulated Phase Change Materials (PCMs) for Liquid Cooling of High-Powered Electronics

Featured Publications

Kong, D., Jung, E., Kim, Y., Manepalli, V. V., Rah, K. J., Kim, H. S., Hong, Y., Choi, H. G., Agonafer, D., and Lee, H., 2023, “An Additively Manufactured Manifold-Microchannel Heat Sink for High-Heat Flux Cooling,” International Journal of Mechanical Sciences, 248, p. 108228.

Kong, D., Kim, K., Kang, M., Hong, Y., Kim, H.S., Rah, K., Choi, G., Guye, G., Agonafer, D., Lee, H., “Thermal hydraulic design of 3D manifold microchannel heat sinks for energy-efficient thermal management systems”, Case Studies in Thermal Engineering, 2021, DOI: https://doi.org/10.1016/j.csite.2021.101583.

Guye, K., Dong, D., Kim, Y., Lee, H., Dogruoz, B., Agonafer, D., “Guidelines for designing micropillar structures for enhanced evaporative heat transfer”, Journal of Electronic Packaging, 2021, DOI: https://doi.org/10.1115/1.4052465.

Agonafer, D., Miljkovic, N., Spector M.A., “Materials and Interface Challenges and Opportunities in High Vapor Quality Two-Phase Flow Boiling Research.”, IEEE Components & Transactions, 2021, DOI: https://doi.org/10.1109/TCPMT.2021.3085255.

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