Featured News
Current Research
Featured Publications
Kong, D., Jung, E., Kim, Y., Manepalli, V. V., Rah, K. J., Kim, H. S., Hong, Y., Choi, H. G., Agonafer, D., and Lee, H., 2023, “An Additively Manufactured Manifold-Microchannel Heat Sink for High-Heat Flux Cooling,” International Journal of Mechanical Sciences, 248, p. 108228.
Kong, D., Kim, K., Kang, M., Hong, Y., Kim, H.S., Rah, K., Choi, G., Guye, G., Agonafer, D., Lee, H., “Thermal hydraulic design of 3D manifold microchannel heat sinks for energy-efficient thermal management systems”, Case Studies in Thermal Engineering, 2021, DOI: https://doi.org/10.1016/j.csite.2021.101583.
Guye, K., Dong, D., Kim, Y., Lee, H., Dogruoz, B., Agonafer, D., “Guidelines for designing micropillar structures for enhanced evaporative heat transfer”, Journal of Electronic Packaging, 2021, DOI: https://doi.org/10.1115/1.4052465.
Agonafer, D., Miljkovic, N., Spector M.A., “Materials and Interface Challenges and Opportunities in High Vapor Quality Two-Phase Flow Boiling Research.”, IEEE Components & Transactions, 2021, DOI: https://doi.org/10.1109/TCPMT.2021.3085255.