Our Latest Paper “Investigation of the evaporation heat transfer mechanism of a non-axisymmetric droplet confined on a heated micropillar structure” Got Published on International Journal of Heat and Mass Transfer
In scaling computer performance, closely integrating heterogeneous components in a single system-inpackage assembly provides faster signal communication and a tighter footprint – but also generates more heat: state-of-the art microelectronic devices can produce more than 1 kW square-cm. The next generation high-powered electronics will need two-phase liquid cooling, such as droplet evaporation, which utilizes the […]