We are proud to share that Kidus has successfully defended his Ph.D. thesis, marking an important milestone for both him and the NEIT Lab.

Kidus’s research made impactful contributions to advanced thermal management at both the device and system levels. His thesis explored novel junction-level thermal management strategies for AlGaN ultra-wide bandgap (UWBG) electronics, addressing the critical challenge of heat dissipation in next-generation high-power, high-frequency devices. In parallel, he conducted fundamental studies on two-phase hollow micropillar evaporators, advancing the understanding of thin-film evaporation, phase separation, and high heat flux dissipation mechanisms. His work combined rigorous experimental characterization with physics-based modeling to provide new insights into transport phenomena governing these systems.

Together, these contributions bridge the gap between material/device-level thermal constraints and scalable cooling architectures, enabling more reliable and efficient operation of future electronic platforms.

Beyond his technical achievements, Kidus has been an integral part of the lab, mentoring junior researchers, fostering collaboration, and contributing to a strong and supportive research environment.

We are also excited to announce that Kidus will be joining AMD as a Senior Thermal Engineer, where he will continue to push the boundaries of thermal engineering in the semiconductor industry.

Congratulations, Kidus, on this outstanding achievement, and wishing him continued success in this next chapter of his career.