Exciting new paper about 3-component composite PCM. Results suggest these composites outperform pure copper in reducing peak device temperatures under transient heat loads, showing promise for efficient thermal management in electronics. Pre-released version can be found here: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10477652
Mariah’s new paper on Composite PCM Read More »
We recently won the UMD-Northrop Grumman Innovation grant! We will be using the grant to study micro-encapsulated PCM slurry based microchannel cooling for high powered electronics.
We won the UMD-Northrop Grumman Innovation grant Read More »
Vivek presented his research on thermal and electro-mechanical modeling of vacuum field effect transistors at the North Atlantic Thermal Analysis Conference (NATAS). The conference was held in Rockville, Maryland in June 2023. This research is funded by AFOSR MURI on vacuum field effect nano-electronics.
Despite the impact of the COVID-19 pandemic in 2020, the College Prep BEAT THE HEAT workshop has come back in 2021 with a new cohort of students. The program is targeted to help low-income high school students get exposed to university environments and to educate and inspire students to get a higher education after high
BEAT THE HEAT Workshop 2021 Read More »
Please check out our latest paper where we discuss recent research progress on structured surfaces for enhanced flow boiling. We discuss lessons learned and focus on remaining challenges. The content of our paper represents a summary from discussions at the Office of Naval Research Workshop on ‘Research Needs in High Quality Two-Phase Flow’ held in
Google has decided to continue funding $86,419 to NEIT lab for the third year to develop an evaporative cooling module, which can be applied to dissipate heat from Google’s data centers in the future. This achievement comes from the hard work of everyone in the lab so congrats to everyone, especially Dr. Damena Agonafer. On
Google continues its support for NEIT lab data center cooling tech Read More »
Read more at : Chillin’ out: Innovating effective thermal management technologies through solid-liquid-vapor nanointeractions
NEIT Lab’s technology featured on Washington University Climate Change Program Read More »
2 of ours papers just got accepted to the Applied Thermal Engineering Journal are: Review article: Microscale evaporative cooling technologies for high heat flux microelectronics devices: Background and recent advances and Molecular dynamics simulations of thin-film evaporation: The influence of interfacial thermal resistance on a graphene-coated heated silicon substrate Congrats to all the hard work
Our lastest publications on Applied Thermal Engineering Read More »
Dr. Damena Agonafer has become one of 85 early-career engineers selected to attend the National Academy of Engineering’s 26th annual US Frontiers of Engineering symposium (USFOE). Read more on the news
Dr. Agonafer selected for Frontiers of Engineering Symposium Read More »
Dr. Damena Agonafer received a five-year $500,000 CAREER Award from the National Science Foundation (NSF) to identify different modes of heat transfer during the evaporation process of nonsymmetrical microdroplets that sit atop micropillar structures on a cooling platform. We would like to congratulate our PI, Dr. Agonafer, on this great achievement. On the news
Dr. Agonafer receives NSF CAREER Award Read More »
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