News

The NEIT Lab proudly announces that its PI, Professor Damena Agonafer, has been awarded the Presidential Early Career Award for Scientists and Engineers (PECASE) for 2025. This is the highest honor bestowed by the United States government on outstanding early-career scientists and engineers. This prestigious recognition underscores Professor Agonafer’s groundbreaking contributions to thermal fluid sciences, interfacial transport phenomena, […]

Prof. Damena Agonafer, Director of the NEIT Lab, was an invited speaker at the 12th International Conference of the Materials Research Society, held in Kigali, Rwanda. Prof. Agonafer’s talk, delivered as part of the Sustainable Electronics track, addressed the critical challenges in next-generation thermal management technologies for state-of-the-art GPUs and CPUs used in AI/ML workloads

Kidus Guye presented his work on designing and modeling a novel hollow micropillar evaporator for high AI/ML workloads in state-of-the-art data centers for low PUE two-phase cooling. This work is part of the ARPA-e COOLERCHIPS project geared towards developing next-generation liquid cooling technologies with significantly low junction-to-coolant thermal resistance, with PUE lower than 1.02. Also

Dr. Vivek Pandey joins the NEIT Lab as a PostDoc to primarily support the effort to develop evaporative cooling cold plates for data centers and also advise the graduate students on other two-phase cooling technologies. He brings extensive experience building hybrid-cooled data centers and heat sink topology optimization from the National University of Singapore. We

Exciting new paper about 3-component composite PCM. Results suggest these composites outperform pure copper in reducing peak device temperatures under transient heat loads, showing promise for efficient thermal management in electronics. Pre-released version can be found here: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10477652