Exciting new paper about 3-component composite PCM. Results suggest these composites outperform pure copper in reducing peak device temperatures under transient heat loads, showing promise for efficient thermal management in electronics. Pre-released version can be found here: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10477652
Mariah’s new paper on Composite PCM Read More »
We recently won the UMD-Northrop Grumman Innovation grant! We will be using the grant to study micro-encapsulated PCM slurry based microchannel cooling for high powered electronics.
We won the UMD-Northrop Grumman Innovation grant Read More »
Vivek presented his research on thermal and electro-mechanical modeling of vacuum field effect transistors at the North Atlantic Thermal Analysis Conference (NATAS). The conference was held in Rockville, Maryland in June 2023. This research is funded by AFOSR MURI on vacuum field effect nano-electronics.
Kidus Guye presented his work titled ‘Development of a Novel Direct-to-Chip Evaporator using Hollow Micropillars for Thermal Management in High Heat Flux Applications’ at NASA’s 34th Thermal & Fluids Analysis Workshop held in College Park from August 21-24. His work was very well received and he received second place in the poster presentation for a
Emils Jurcik joins NEIT lab this fall 2023 as a PhD student. He is co-advised by Prof. Samuel Graham and Prof. Agonafer. He got his undergraduate degree in Mechanical Engineering at Northwestern University and worked in the industry for a year prior to joining UMD. He will work on thermal management and thermal measurements of
Emils Joins NEIT Lab in Fall 2023 Read More »
Three new students join NEIT Lab starting this fall 2023. Emils Jurcik is a Ph.D. student (co-advised by Prof. Samuel Graham) starting in the NEIT lab in the fall of 2023. He will be working on the thermal management of WBG power electronics and thermal measurements of solid-state devices. Anagh Dave is a master’s student
NEIT Lab welcomes four new students in Fall 2023 Read More »
Dr. Damena Agonafer was invited as a keynote speaker to the MicroFIP conference in Chicago. His talk titled – ‘Two-phase cooling for high heat flux applications’ included discussion on some of the state-of-the-art two phase thermal management systems and their challenges, NEIT lab evaporator technology, and the future work and operational challenges in implementing these
Dr. Agonafer is invited as a keynote speaker MicroFIP conference in Chicago Read More »
The NEIT Lab has secured two prestigious DARPA projects to advance thermal management in high power GaN RF devices. These projects aim to reduce device thermal resistance, improve power density, and enhance overall performance. In the first project, researchers will integrate high thermal conductivity dielectric materials with GaN RF transistors, enabling a better understanding of
The Nanoscale Energy and Interfacial Transport (NEIT) Lab, part of the Mechanical Engineering Department at the University of Maryland (UMD) College Park, is proud to announce its successful participation in the highly competitive COOLERCHIPS program by the Advanced Research Projects Agency-Energy (ARPA-E), a division of the U.S. Department of Energy. Out of a total of
Andoniaina Mariah Randriambololona joins NEIT lab as PhD student. She graduated from University of the District of Columbia in 2022 with a B.S. degree in Mechanical Engineering. She will be working on novel phase change materials, development of ML tools for CFD, and single phase immersion cooling.
Mariah Joins NEIT Lab Read More »
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