Publications
2024
2023
Kong, D., Jung, E., Kim, Y., Manepalli, V. V., Rah, K. J., Kim, H. S., Hong, Y., Choi, H. G., Agonafer, D., and Lee, H., 2023, “An Additively Manufactured Manifold-Microchannel Heat Sink for High-Heat Flux Cooling,” International Journal of Mechanical Sciences, 248, p. 108228.
2022
Vivek V. Manepalli, Kidus Guye, Erdong Song, Alex Dutton, Daniel Luberda, Quan Chau, Yousof Nayfeh, Troy Beechner, Sean H. Hoenig, Michael C. Ellis, Agonafer. D., “Hollow Micropillar Evaporator for Cooling Wide-Bandgap Silicon Carbide Power Converters.” ITherm Conference, San Diego, CA, USA 2022.
2021
Kong, D., Kim, K., Kang, M., Hong, Y., Kim, H.S., Rah, K., Choi, G., Guye, G., Agonafer, D., Lee, H., “Thermal hydraulic design of 3D manifold microchannel heat sinks for energy-efficient thermal management systems”, Case Studies in Thermal Engineering, 2021, DOI: https://doi.org/10.1016/j.csite.2021.101583.
Guye, K., Dong, D., Kim, Y., Lee, H., Dogruoz, B., Agonafer, D., “Guidelines for designing micropillar structures for enhanced evaporative heat transfer”, Journal of Electronic Packaging, 2021, DOI: https://doi.org/10.1115/1.4052465.
Agonafer, D., Miljkovic, N., Spector M.A., “Materials and Interface Challenges and Opportunities in High Vapor Quality Two-Phase Flow Boiling Research.”, IEEE Components & Transactions, 2021, DOI: https://doi.org/10.1109/TCPMT.2021.3085255.
Nahar, M., Ma, B., Chau, Q.H., Padilla, J., Iyengar, M., Agonafer, D., “Review article: Microscale evaporative cooling technologies for high- heat flux microelectronics devices: background and recent advances.”, Applied Thermal Engineering 2021, 194(117109). DOI: https://doi.org/10.1016/j.applthermaleng. 2021.117109.
Ma, B., Guye, G., Dogruoz B., Agonafer, D., “Molecular Dynamics simulations of thin-film evaporation: the influence of interfacial thermal resistance on a graphene-coated heated silicon substrate.”, Applied Thermal Engineering Volume 195, August 2021, 117142, DOI: https://doi.org/10.1016/j.applthermaleng. 2021.117142.
Guye, K, Chau, Q., Song, E., Agonafer, D., “Investigation on the optimization of arrays of micropillar structures for enhanced microscale evaporative cooling.” InterPack conference, Virtually, 2021
Guye, K, Yang, Z., Chau, Q., Dong, D., Agonafer, D., “Design and optimization guidelines for micropillar structures for enhanced evaporative cooling.” InterPack conference poster presentation, Virtually, 2021
2020
Guye, K, Nahar, M., Chau, Q., Agonafer, D., “Design and Optimization Array of Micropillar Structures for Enhanced Evaporative Cooling of High-Powered Electronics.” Semi-Therm Conference, Virtually, 2020.
Melissa K. McCann, Michael C. Fish, Lauren M. Boteler, Agonafer, D., “Analyzing the Distribution of Microencapsulated Organic Phase Change Materials Embedded in a Metallic Matrix.” ITherm Conference, Orlando, FL, USA 2020.
M.M. Nahar, H. Wu, Z. Yang, A. Austin, J. Padilla, M. Iyengar, Agonafer, D., “Design and Optimization of Hollow Micropillar Structures for Enhanced Evaporative Cooling of High- Powered Electronics.” Semi-Therm Conference, San Jose, CA, USA 2020.
2019
Shan, L., Shuai, S, Ma, B., Du, Z., Dogruoz, B., Agonafer, D., “Numerical investigation of shape effect on microdroplet evaporation.” Journal of Electronic Packaging 2019, 141(4). DOI:10.1115/1.4044962.
Ma, B., Shan, L., Dogruoz, B., Agonafer, D., Evolution of Microdroplet Morphology Confined on Asymmetric Micropillar Structures. Langmuir 2019, 35(37), 12264-12275. DOI: 10.1021/acs.langmuir.9b01410.
Shan, L., Li, J., Ma, B., Jiang, X., Dogruoz, B., Agonafer, D., “Experimental investigation of evaporation from asymmetric microdroplets confinedon heated micropillar structures.” Experimental Thermal and Fluid Science 2019, 109, 109889.DOI: 10.1016/j.expthermflusci.2019.109889.
Li, J., Shan, L., Ma, B., Jiang, X., Solomon, A., Iyengar, M., Padilla, J., and Agonafer, D., “Investigation of the confinement effect on the evaporation behavior of a droplet pinned on a micropillar structure.” Journal of colloid and interface science, 2019, 555, pp.583-594.DOI: 10.1016/j.jcis.2019.07.096.
Shan, L., Ma, B., Li, J., Dogruoz, B., Agonafer, D., “Investigation of the evaporation heat transfer mechanism of a non-axisymmetric droplet confined on a heated micropillar structure.” International Journal of Heat and Mass Transfer 2019, 141, 191-203. DOI: 10.1016/j.ijheatmasstransfer.2019.06.042.
B. Ma, R. Zhou, L. Shan, J. Li, B. Dogruoz, Agonafer, D., “Molecular dynamics Simulation ofThin-Film Evaporation from Nanocoated Surfaces: The Asymptotic Relationship between Evaporation Rate and Nanocoating Thickness.” International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems Conference and Exhibition, Anaheim, CA, October 2019.
Shan, R. Zhang, X. Jiang, B. Ma, J. Padilla, Agonafer, D. “Experimental investigation of asymmetrical microdroplet evaporation on heated porous pillar array structures.” InternationalTechnical Conference on Packaging and Integration of Electronic and Photonic Microsystems Conference and Exhibition, Anaheim, CA, October 2019
Li, L. Shan, B. Ma, J. Padilla, Agonafer, D., “Evaporation of microdroplet suspended on micropillar structure – the effect of pillar height on vapor diffusion efficiency.” 2019 Summer Heat Transfer Conference, Bellevue, WA, July 2019
Li, H. Wu, B. Ma, L. Shan, J. Padilla, Agonafer, D., “Geometric optimization of a microdroplet for enhanced evaporative heat transfer.” 2019 Summer Heat Transfer Conference,Bellevue, WA, July 2019
Ma, L. Shan, B. Dogruoz, Agonafer, D., “Molecular dynamics Simulation of Evaporative Heat Transfer on Graphene Coated Silicon Substrate for Electronics Cooling.” SEMI-Therm 35th Annual Symposium, San Jose, CA, March 2019
Shan, B. Ma, B. Dogruoz, Agonafer, D., “Experimental and Numerical Investigation of Microdroplets Evaporating on Porous Micropillar Structures.” SEMI-Therm 35th Annual Symposium, San Jose, CA, March 2019
Ma, R. Zhou, L. Shan, B. Dogruoz, Agonafer, D., “Molecular Dynamic Simulation of Evaporative Heat Transfer on Graphene Coated Silicon Substrate for Electronics Cooling.” The Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems,Las Vegas, NV, May 2019
Ma, L. Shan, B. Dogruoz, Agonafer, D., “Molecular dynamics Simulation of Evaporative Heat Transfer on Graphene Coated Silicon Substrate for Electronics Cooling.” SEMI-Therm 35th Annual Symposium, San Jose, CA, March 2019
Shan, B. Ma, B. Dogruoz, Agonafer, D., “Experimental and Numerical Investigation of Microdroplets Evaporating on Porous Micropillar Structures.” SEMI-Therm 35th Annual Symposium, San Jose, CA, March 2019
Ma, R. Zhou, L. Shan, B. Dogruoz, Agonafer, D., “Molecular Dynamic Simulation of Evaporative Heat Transfer on Graphene Coated Silicon Substrate for Electronics Cooling.” The Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems,Las Vegas, NV, 2019
Ma, L. Shan, J. Li, R. Zhang, X, Jiang, B. Dogruoz, Agonafer, D., “Evaporation of Microdroplet Suspended on Porous Micropillar Structure: The Effect of Micropillar Height on Transport Performance.” International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems Conference and Exhibition, Anaheim, CA, 2019
Ma, R. Zhou, L. Shan, J. Li, B. Dogruoz, Agonafer, D., “Molecular dynamics Simulation ofThin-Film Evaporation from Nanocoated Surfaces: The Asymptotic Relationship between Evaporation Rate and Nanocoating Thickness.” International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems Conference and Exhibition, Anaheim, CA, 2019.
Shan, R. Zhang, X. Jiang, B. Ma, J. Padilla, Agonafer, D. “Experimental investigation of asymmetrical microdroplet evaporation on heated porous pillar array structures.” International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems Conference and Exhibition, Anaheim, CA, 2019.
Agonafer, D., “Phase Change Heat Transfer During Microdroplet Evaporation – The Effect of Geometric Parameters” Gordon Research Conference on Micro and Nanoscale Phase Change Heat Transfer, Lucca (Barga), IT, February 2019.
2018
Agonafer, D., H. Lee, P.A. Vasquez, Y. Won, K.W. Jung, S. Lingamnen, B. Ma, L. Shan, S. Shuai, Z. Du, Goodson, K.G.,”Porous micropillar structures for retaining low surface tension liquids.” Journal of Colloid andInterface Science 2018, 514, 316-327. DOI: /10.1016/j.jcis.2017.12.011, Cover Image.
Shan, B. Ma, B. Dogruoz, Agonafer, D., “Fundamental Mechanisms of Evaporation Kinetics of Non- Spherical Microdroplets Confined by Asymmetric Micropillar Structures.” International Mechanical Engineering Congress and Exposition (IMECE), Pittsburgh, PA, November 2018.
Ma, L. Shan, S. Shuai, Z. Du, B. Dogruoz, Agonafer, D., “Investigation of the Role of Surface Nanocoating on Two-phase Evaporation Heat and Mass Transfer Using Molecular Dynamic Simulation.” International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPack), San Francisco, CA, August2018.
Shan, B. Ma, S. Shuai, Z. Du, B. Dogruoz, Agonafer, D., “Experimental Investigation of Microdroplet Evaporation on a Porous Micropillar Structure.” International Technical Conference Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPack), San Francisco, CA, August 2018.
Shuai, L. Shan, B. Ma, Z. Du, B. Dogruoz, Agonafer, D., “Numerical Investigation of Shape Effect on Microdroplet Evaporation.” International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPack), San Francisco, CA, August 2018.
2017
W. Palko, H. Lee, C. Zhang, T.J. Dusseault, T. Maitra, Y. Won, Agonafer, D., J. Moss, F. Houshmand, Rong, G., Goodson, K., “Extreme Two-Phase Cooling from Laser-Etched Diamond and Conformal,Template-Fabricated Microporous Copper.” Advanced Functional Materials, 2017, 27 (45). DOI: 10.1002/adfm.201703265.
2016
Lee, Agonafer, D. (First Co-Author), Y. Won, F. Houshmand, C. Gorle, M. Asheghi, K.E. Goodson, “Thermal modeling of extreme heat flux microchannel coolers for GaN-on- SiC semiconductor devices.” Journal of Electronic Packaging 2016, 138 (1), 010907. DOI: 10.1115/1.4032655.
2015
Won, J. Cho, Agonafer, D., M. Asheghi, K.E. Goodson, “Fundamental cooling limits for high power density gallium nitride electronics.” IEEE Transactions on Components, Packaging and Manufacturing Technology 2015, 5(6), 737-744. DOI: 10.1109/TCPMT.2015.2433132.Agonafer, D., K. Lopez, J.W. Palko, Y. Won, J.G. Santiago, K.E. Goodson, “Burst behavior at a capillary tip: Effect of low and high surface tension.” Journal of Colloid and Interface Science 2015, 455, 1-5. DOI: 10.1016/j.jcis.2015.05.033.
2014
Agonafer, D., M.E. Oruc, E. Chainani, K.S. Lee, H. Hu, M.A. Shannon, “Study of ionic transport through metalized nanoporous membranes functionalized with self- assembled monolayers.” Journal of Membrane Science 2014, 461, 106-113. DOI: 10.1016/j.memsci.2014.03.009.
2012
Agonafer, D., E. Chainani, Oruc, M.E., Lee, K.S., Shannon, M.A., “Study of insulating properties of alkanethiol self- assembled monolayers formed under prolonged incubation using electrochemical impedance spectroscopy.” Journal of Nanotechnology in Engineering and Medicine 2012, 3 (3), 031006. DOI: Nanotechnology. Eng. Med. Aug 2012, 3(3):031006 (8 pages). DOI:10.1115/1.4007698.
2011
Agonafer, D., Yeom, J., Shannon, M.A., “Three-Dimensional CFD Model of Pressure Drop in µTAS Devices in a Microchannel.” Journal of Electronic Packaging 2011, 133 (3), 031011. DOI: 10.1115/1.4004217.
2009
Prakash, R. Akberov, Agonafer, D., A.D. Armijo, M. Shannon, “Influence of Boundary Conditions on Sub-Millimeter Combustion.” Energy & Fuels, 23(7), pp.3549- 3557. DOI: 10.1021/ef900040q.
Yeom, Agonafer, D., J-H Ha, Shannon, M.A., “Low Reynolds Number flow across an array of cylindrical microposts in a microchannel and figure-of-merit analysis of micropost-filled microreactors.” Journal of Micromechanics and Microengineering, 19(6), p.065025. DOI:10.1088/0960- 1317/19/6/065025.
Randriambololona, Andoniaina., Manepalli, Vivek., McAfee, Rachel., Ojha, Bidisha., Miraftab-Salo, Rahi., Guye, Kidus., Lee, Hyoungsoon & Graham, Samuel & Agonafer, Damena. (2024). 3-Component Composite Phase Change Material (PCM) for Electronics Subject to Transient/Pulsed Heat Loads. IEEE Transactions on Components, Packaging and Manufacturing Technology. PP. 1-1. 10.1109/TCPMT.2024.3376234.
Kong, D., Jung, E., Kim, Y., Manepalli, V. V., Rah, K. J., Kim, H. S., Hong, Y., Choi, H. G., Agonafer, D., and Lee, H., 2023, “An Additively Manufactured Manifold-Microchannel Heat Sink for High-Heat Flux Cooling,” International Journal of Mechanical Sciences, 248, p. 108228.
Kong, D., Kim, K., Kang, M., Hong, Y., Kim, H.S., Rah, K., Choi, G., Guye, G., Agonafer, D., Lee, H., “Thermal hydraulic design of 3D manifold microchannel heat sinks for energy-efficient thermal management systems”, Case Studies in Thermal Engineering, 2021, DOI: https://doi.org/10.1016/j.csite.2021.101583.
Guye, K., Dong, D., Kim, Y., Lee, H., Dogruoz, B., Agonafer, D., “Guidelines for designing micropillar structures for enhanced evaporative heat transfer”, Journal of Electronic Packaging, 2021, DOI: https://doi.org/10.1115/1.4052465.
Agonafer, D., Miljkovic, N., Spector M.A., “Materials and Interface Challenges and Opportunities in High Vapor Quality Two-Phase Flow Boiling Research.”, IEEE Components & Transactions, 2021, DOI: https://doi.org/10.1109/TCPMT.2021.3085255.
Nahar, M., Ma, B., Chau, Q.H., Padilla, J., Iyengar, M., Agonafer, D., “Review article: Microscale evaporative cooling technologies for high- heat flux microelectronics devices: background and recent advances.”, Applied Thermal Engineering 2021, 194(117109). DOI: https://doi.org/10.1016/j.applthermaleng. 2021.117109.
Ma, B., Guye, G., Dogruoz B., Agonafer, D., “Molecular Dynamics simulations of thin-film evaporation: the influence of interfacial thermal resistance on a graphene-coated heated silicon substrate.”, Applied Thermal Engineering Volume 195, August 2021, 117142, DOI: https://doi.org/10.1016/j.applthermaleng. 2021.117142.
Shan, L., Shuai, S, Ma, B., Du, Z., Dogruoz, B., Agonafer, D., “Numerical investigation of shape effect on microdroplet evaporation.” Journal of Electronic Packaging 2019, 141(4). DOI:10.1115/1.4044962.
Ma, B., Shan, L., Dogruoz, B., Agonafer, D., Evolution of Microdroplet Morphology Confined on Asymmetric Micropillar Structures. Langmuir 2019, 35(37), 12264-12275. DOI: 10.1021/acs.langmuir.9b01410, Cover Image.
Shan, L., Li, J., Ma, B., Jiang, X., Dogruoz, B., Agonafer, D., “Experimental investigation of evaporation from asymmetric microdroplets confinedon heated micropillar structures.” Experimental Thermal and Fluid Science 2019, 109, 109889.DOI: 10.1016/j.expthermflusci.2019.109889.
Li, J., Shan, L., Ma, B., Jiang, X., Solomon, A., Iyengar, M., Padilla, J., and Agonafer, D., “Investigation of the confinement effect on the evaporation behavior of a droplet pinned on a micropillar structure.” Journal of colloid and interface science, 2019, 555, pp.583-594.DOI: 10.1016/j.jcis.2019.07.096.
Shan, L., Ma, B., Li, J., Dogruoz, B., Agonafer, D., “Investigation of the evaporation heat transfer mechanism of a non-axisymmetric droplet confined on a heated micropillar structure.” International Journal of Heat and Mass Transfer 2019, 141, 191-203. DOI: 10.1016/j.ijheatmasstransfer.2019.06.042.
Agonafer, D., H. Lee, P.A. Vasquez, Y. Won, K.W. Jung, S. Lingamnen, B. Ma, L. Shan, S. Shuai, Z. Du, Goodson, K.G.,”Porous micropillar structures for retaining low surface tension liquids.” Journal of Colloid andInterface Science 2018, 514, 316-327. DOI: /10.1016/j.jcis.2017.12.011, Cover Image.
J. W. Palko, H. Lee, C. Zhang, T.J. Dusseault, T. Maitra, Y. Won, Agonafer, D., J. Moss, F. Houshmand, Rong, G., Goodson, K., “Extreme Two-Phase Cooling from Laser-Etched Diamond and Conformal,Template-Fabricated Microporous Copper.” Advanced Functional Materials, 2017, 27 (45). DOI: 10.1002/adfm.201703265.
H. Lee, Agonafer, D. (First Co-Author), Y. Won, F. Houshmand, C. Gorle, M. Asheghi, K.E. Goodson, “Thermal modeling of extreme heat flux microchannel coolers for GaN-on- SiC semiconductor devices.” Journal of Electronic Packaging 2016, 138 (1), 010907. DOI: 10.1115/1.4032655.
Y. Won, J. Cho, Agonafer, D., M. Asheghi, K.E. Goodson, “Fundamental cooling limits for high power density gallium nitride electronics.” IEEE Transactions on Components, Packaging and Manufacturing Technology 2015, 5(6), 737-744. DOI: 10.1109/TCPMT.2015.2433132.Agonafer, D., K. Lopez, J.W. Palko, Y. Won, J.G. Santiago, K.E. Goodson, “Burst behavior at a capillary tip: Effect of low and high surface tension.” Journal of Colloid and Interface Science 2015, 455, 1-5. DOI: 10.1016/j.jcis.2015.05.033.
Agonafer, D., M.E. Oruc, E. Chainani, K.S. Lee, H. Hu, M.A. Shannon, “Study of ionic transport through metalized nanoporous membranes functionalized with self- assembled monolayers.” Journal of Membrane Science 2014, 461, 106-113. DOI: 10.1016/j.memsci.2014.03.009.
Agonafer, D., E. Chainani, Oruc, M.E., Lee, K.S., Shannon, M.A., “Study of insulating properties of alkanethiol self- assembled monolayers formed under prolonged incubation using electrochemical impedance spectroscopy.” Journal of Nanotechnology in Engineering and Medicine 2012, 3 (3), 031006. DOI: Nanotechnology. Eng. Med. Aug 2012, 3(3):031006 (8 pages). DOI:10.1115/1.4007698.
Agonafer, D., Yeom, J., Shannon, M.A., “Three-Dimensional CFD Model of Pressure Drop in µTAS Devices in a Microchannel.” Journal of Electronic Packaging 2011, 133 (3), 031011. DOI: 10.1115/1.4004217.
S. Prakash, R. Akberov, Agonafer, D., A.D. Armijo, M. Shannon, “Influence of Boundary Conditions on Sub-Millimeter Combustion.” Energy & Fuels, 23(7), pp.3549- 3557. DOI: 10.1021/ef900040q.
J. Yeom, Agonafer, D., J-H Ha, Shannon, M.A., “Low Reynolds Number flow across an array of cylindrical microposts in a microchannel and figure-of-merit analysis of micropost-filled microreactors.” Journal of Micromechanics and Microengineering, 19(6), p.065025. DOI:10.1088/0960- 1317/19/6/065025.
Vivek V. Manepalli, Kidus Guye, Erdong Song, Alex Dutton, Daniel Luberda, Quan Chau, Yousof Nayfeh, Troy Beechner, Sean H. Hoenig, Michael C. Ellis, Agonafer. D., “Hollow Micropillar Evaporator for Cooling Wide-Bandgap Silicon Carbide Power Converters.” ITherm Conference, San Diego, CA, USA 2022.
Guye, K, Chau, Q., Song, E., Agonafer, D., “Investigation on the optimization of arrays of micropillar structures for enhanced microscale evaporative cooling.” InterPack conference, Virtually, 2021
Guye, K, Yang, Z., Chau, Q., Dong, D., Agonafer, D., “Design and optimization guidelines for micropillar structures for enhanced evaporative cooling.” InterPack conference poster presentation, Virtually, 2021
Guye, K, Nahar, M., Chau, Q., Agonafer, D., “Design and Optimization Array of Micropillar Structures for Enhanced Evaporative Cooling of High-Powered Electronics.” Semi-Therm Conference, Virtually, 2020.
Melissa K. McCann, Michael C. Fish, Lauren M. Boteler, Agonafer, D., “Analyzing the Distribution of Microencapsulated Organic Phase Change Materials Embedded in a Metallic Matrix.” ITherm Conference, Orlando, FL, USA 2020.
M.M. Nahar, H. Wu, Z. Yang, A. Austin, J. Padilla, M. Iyengar, Agonafer, D., “Design and Optimization of Hollow Micropillar Structures for Enhanced Evaporative Cooling of High- Powered Electronics.” Semi-Therm Conference, San Jose, CA, USA 2020.
B. Ma, L. Shan, J. Li, R. Zhang, X, Jiang, B. Dogruoz, Agonafer, D., “Evaporation of a Microdroplet Suspended on Porous Micropillar Structure: The Effect of Micropillar Height on Transport Performance.” International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems Conference and Exhibition, Anaheim, CA, October 2019.
B. Ma, R. Zhou, L. Shan, J. Li, B. Dogruoz, Agonafer, D., “Molecular dynamics Simulation ofThin-Film Evaporation from Nanocoated Surfaces: The Asymptotic Relationship between Evaporation Rate and Nanocoating Thickness.” International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems Conference and Exhibition, Anaheim, CA, October 2019.
L. Shan, R. Zhang, X. Jiang, B. Ma, J. Padilla, Agonafer, D. “Experimental investigation of asymmetrical microdroplet evaporation on heated porous pillar array structures.” InternationalTechnical Conference on Packaging and Integration of Electronic and Photonic Microsystems Conference and Exhibition, Anaheim, CA, October 2019
J. Li, L. Shan, B. Ma, J. Padilla, Agonafer, D., “Evaporation of microdroplet suspended on micropillar structure – the effect of pillar height on vapor diffusion efficiency.” 2019 Summer Heat Transfer Conference, Bellevue, WA, July 2019
J. Li, H. Wu, B. Ma, L. Shan, J. Padilla, Agonafer, D., “Geometric optimization of a microdroplet for enhanced evaporative heat transfer.” 2019 Summer Heat Transfer Conference,Bellevue, WA, July 2019
B. Ma, L. Shan, B. Dogruoz, Agonafer, D., “Molecular dynamics Simulation of Evaporative Heat Transfer on Graphene Coated Silicon Substrate for Electronics Cooling.” SEMI-Therm 35th Annual Symposium, San Jose, CA, March 2019
L. Shan, B. Ma, B. Dogruoz, Agonafer, D., “Experimental and Numerical Investigation of Microdroplets Evaporating on Porous Micropillar Structures.” SEMI-Therm 35th Annual Symposium, San Jose, CA, March 2019
B. Ma, R. Zhou, L. Shan, B. Dogruoz, Agonafer, D., “Molecular Dynamic Simulation of Evaporative Heat Transfer on Graphene Coated Silicon Substrate for Electronics Cooling.” The Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems,Las Vegas, NV, May 2019
B. Ma, L. Shan, B. Dogruoz, Agonafer, D., “Molecular dynamics Simulation of Evaporative Heat Transfer on Graphene Coated Silicon Substrate for Electronics Cooling.” SEMI-Therm 35th Annual Symposium, San Jose, CA, March 2019
L. Shan, B. Ma, B. Dogruoz, Agonafer, D., “Experimental and Numerical Investigation of Microdroplets Evaporating on Porous Micropillar Structures.” SEMI-Therm 35th Annual Symposium, San Jose, CA, March 2019
B. Ma, R. Zhou, L. Shan, B. Dogruoz, Agonafer, D., “Molecular Dynamic Simulation of Evaporative Heat Transfer on Graphene Coated Silicon Substrate for Electronics Cooling.” The Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems,Las Vegas, NV, 2019
B. Ma, L. Shan, J. Li, R. Zhang, X, Jiang, B. Dogruoz, Agonafer, D., “Evaporation of Microdroplet Suspended on Porous Micropillar Structure: The Effect of Micropillar Height on Transport Performance.” International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems Conference and Exhibition, Anaheim, CA, 2019
B. Ma, R. Zhou, L. Shan, J. Li, B. Dogruoz, Agonafer, D., “Molecular dynamics Simulation ofThin-Film Evaporation from Nanocoated Surfaces: The Asymptotic Relationship between Evaporation Rate and Nanocoating Thickness.” International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems Conference and Exhibition, Anaheim, CA, 2019.
L. Shan, R. Zhang, X. Jiang, B. Ma, J. Padilla, Agonafer, D. “Experimental investigation of asymmetrical microdroplet evaporation on heated porous pillar array structures.” International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems Conference and Exhibition, Anaheim, CA, 2019.
Agonafer, D., “Phase Change Heat Transfer During Microdroplet Evaporation – The Effect of Geometric Parameters” Gordon Research Conference on Micro and Nanoscale Phase Change Heat Transfer, Lucca (Barga), IT, February 2019.
L. Shan, B. Ma, B. Dogruoz, Agonafer, D., “Fundamental Mechanisms of Evaporation Kinetics of Non- Spherical Microdroplets Confined by Asymmetric Micropillar Structures.” International Mechanical Engineering Congress and Exposition (IMECE), Pittsburgh, PA, November 2018.
B. Ma, L. Shan, S. Shuai, Z. Du, B. Dogruoz, Agonafer, D., “Investigation of the Role of Surface Nanocoating on Two-phase Evaporation Heat and Mass Transfer Using Molecular Dynamic Simulation.” International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPack), San Francisco, CA, August2018.
L. Shan, B. Ma, S. Shuai, Z. Du, B. Dogruoz, Agonafer, D., “Experimental Investigation of Microdroplet Evaporation on a Porous Micropillar Structure.” International Technical Conference Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPack), San Francisco, CA, August 2018.
S. Shuai, L. Shan, B. Ma, Z. Du, B. Dogruoz, Agonafer, D., “Numerical Investigation of Shape Effect on Microdroplet Evaporation.” International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPack), San Francisco, CA, August 2018
US Patent Application No. 17/203,677 entitled “Systems and Methods for Forming 1. MicropillarArray – Lead: Damena Agonafer
US Patent Application No. 17/267,539 entitled “Methods and Systems for Evaporation of Liquidfrom Droplet Confined on Hollow Pillar – Lead: Damena Agonafer, Co- Inventors: Binjian Ma,Li Shan, Mark Meacham, Patricia Weisensee. Invention Disclosure, “Hierarchically Structured Porous Wicking Material” – Lead: Damena Agonafer, Co- Inventors: Binjian Ma, Mark Meacham, Patricia Weisensee.
Agonafer, D., Nahar, M., Ma, B., Yang, Z., Chau, Q., Song, E., Padilla, J., Iyengar, M., “Evaporative Cooling for High Heat Flux Applications.” Embedded Cooling of Electronic Devices, Encyclopedia of Thermal Packaging, World Scientific Publishing Co, 2021, In Press.