Featured News
Kidus and Emils Present at ASPIRE Conference in Nagoya, Japan
Kidus Guye and Emils Jurcik represented the laboratory at the annual ASPIRE Conference, hosted at Nagoya University, where they presented
NEIT Lab Students Present at Northrop Grumman University Research Symposium
On July 7th, 2024, several members of the NEIT Lab participated in the Northrop Grumman University Research Symposium held in
ARPA-E Program Managers Visit NEIT Lab to Review COOLERCHIPS Progress
On June 5th, 2024, the NEIT Lab at the University of Maryland had the privilege of hosting Dr. Laurent Pilon,
Current Research
Featured Publications
Kong, D., Jung, E., Kim, Y., Manepalli, V. V., Rah, K. J., Kim, H. S., Hong, Y., Choi, H. G., Agonafer, D., and Lee, H., 2023, “An Additively Manufactured Manifold-Microchannel Heat Sink for High-Heat Flux Cooling,” International Journal of Mechanical Sciences, 248, p. 108228.
Kong, D., Kim, K., Kang, M., Hong, Y., Kim, H.S., Rah, K., Choi, G., Guye, G., Agonafer, D., Lee, H., “Thermal hydraulic design of 3D manifold microchannel heat sinks for energy-efficient thermal management systems”, Case Studies in Thermal Engineering, 2021, DOI: https://doi.org/10.1016/j.csite.2021.101583.
Guye, K., Dong, D., Kim, Y., Lee, H., Dogruoz, B., Agonafer, D., “Guidelines for designing micropillar structures for enhanced evaporative heat transfer”, Journal of Electronic Packaging, 2021, DOI: https://doi.org/10.1115/1.4052465.
Agonafer, D., Miljkovic, N., Spector M.A., “Materials and Interface Challenges and Opportunities in High Vapor Quality Two-Phase Flow Boiling Research.”, IEEE Components & Transactions, 2021, DOI: https://doi.org/10.1109/TCPMT.2021.3085255.