Nanoscale Energy and Interfacial Transport
Nanoscale Energy and Interfacial Transport (NEIT) lab investigates heat transfer at nano, micro-, and mini-scale to develop novel microfluidic two-phase cold plates, phase change materials (PCM), packaging for novel wide band gap power electronics with applications in data centers, power electronics and high frequency communication systems. We work with both industry and government research organizations to investigate fundamental transport phenomena with the goal of development of disruptive thermal technologies.
Nanoscale Energy and Interfacial Transport
Nanoscale Energy and Interfacial Transport (NEIT) lab investigates heat transfer at nano, micro-, and mini-scale to develop novel microfluidic two-phase cold plates, phase change materials (PCM), packaging for novel wide band gap power electronics with applications in data centers, power electronics and high frequency communication systems. We work with both industry and government research organizations to investigate fundamental transport phenomena with the goal of development of disruptive thermal technologies.
Nanoscale Energy and Interfacial Transport
Nanoscale Energy and Interfacial Transport (NEIT) lab investigates heat transfer at nano, micro-, and mini-scale to develop novel microfluidic two-phase cold plates, phase change materials (PCM), packaging for novel wide band gap power electronics with applications in data centers, power electronics and high frequency communication systems. We work with both industry and government research organizations to investigate fundamental transport phenomena with the goal of development of disruptive thermal technologies.
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Nanoscale Energy and Interfacial Transport
Nanoscale Energy and Interfacial Transport (NEIT) lab investigates heat transfer at nano, micro-, and mini-scale to develop novel microfluidic two-phase cold plates, phase change materials (PCM), packaging for novel wide band gap power electronics with applications in data centers, power electronics and high frequency communication systems. We work with both industry and government research organizations to investigate fundamental transport phenomena with the goal of development of disruptive thermal technologies.
Click Here
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Featured Publications

Kong, D., Jung, E., Kim, Y., Manepalli, V. V., Rah, K. J., Kim, H. S., Hong, Y., Choi, H. G., Agonafer, D., and Lee, H., 2023, “An Additively Manufactured Manifold-Microchannel Heat Sink for High-Heat Flux Cooling,” International Journal of Mechanical Sciences, 248, p. 108228.

Kong, D., Kim, K., Kang, M., Hong, Y., Kim, H.S., Rah, K., Choi, G., Guye, G., Agonafer, D., Lee, H., “Thermal hydraulic design of 3D manifold microchannel heat sinks for energy-efficient thermal management systems”, Case Studies in Thermal Engineering, 2021, DOI: https://doi.org/10.1016/j.csite.2021.101583.

Guye, K., Dong, D., Kim, Y., Lee, H., Dogruoz, B., Agonafer, D., “Guidelines for designing micropillar structures for enhanced evaporative heat transfer”, Journal of Electronic Packaging, 2021, DOI: https://doi.org/10.1115/1.4052465.

Agonafer, D., Miljkovic, N., Spector M.A., “Materials and Interface Challenges and Opportunities in High Vapor Quality Two-Phase Flow Boiling Research.”, IEEE Components & Transactions, 2021, DOI: https://doi.org/10.1109/TCPMT.2021.3085255.

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