Harnessing High Thermal Capacitance of Micro-encapsulated Phase Change Materials (PCMs) for Liquid Cooling of High-Powered Electronics

In this project we aim to revolutionize thermal management approaches in defense electronics. With the rapid progression of compact, high-powered electronic systems, there’s an escalating demand for improved thermal performance and reliability in defense applications. This project seeks to address these challenges by developing innovative cooling solutions using microencapsulated phase change materials (MEPCMs). By leveraging the latent heat of MEPCMs, the project aims to enhance heat dissipation capabilities and system reliability, ultimately improving the overall performance of defense electronic systems.

Key objectives of the project include exploring the use of MEPCMs as dielectric coolants to increase the thermal capacity of cooling systems. Additionally, the project focuses on optimizing microchannel designs to facilitate efficient circulation of MEPCM particles and ensure uniform temperature distribution. Innovative helical flow-inducing microchannels are being investigated to maximize heat transfer rates and improve overall cooling efficiency.

Validation and optimization of MEPCM-based cooling systems are conducted through computational fluid dynamics (CFD) simulations and experimental characterization. By validating performance and optimizing system parameters and design configurations, the project aims to achieve the best possible cooling performance for defense electronics applications. Collaboration with industry partners ensures alignment with practical needs, while dissemination of findings through academic conferences and publications contributes to advancements in thermal management technologies for defense applications, ultimately enhancing the reliability and longevity of defense electronic systems.