Our group develop novel thermal technologies for high powered electronics, including novel two-phase evaporative cooling systems, composite phase change materials, packaging on WBG/UWBG electronics, and immersion cooling systems. We also work extensively on developing ML tools for device thermal performance prediction in power electronics and thermal-fluids performance of cold plates. We work extensively with industry and government research agencies. Our current sponsors include ARPA-e, AFOSR, AFRL, NSF, Google, and DARPA